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Bow-shaped Caustics from Conical Prisms: a 13th Century Account of Rainbow Formation from Robert Grosseteste’s De iride (2017)
Journal Article
Harvey, J., Smithson, H., Siviour, C., Gasper, G. E., Sonnesyn, S. O., Tanner, B. K., & McLeish, T. (2017). Bow-shaped Caustics from Conical Prisms: a 13th Century Account of Rainbow Formation from Robert Grosseteste’s De iride. Applied Optics, 56(19), G197-G204. https://doi.org/10.1364/ao.56.00g197

The rainbow has been the subject of discussion across a variety of historical periods and cultures, and numerous optical explanations have been suggested. Here, we further explore the scientific treatise De iride [On the Rainbow] written by Robert Gr... Read More about Bow-shaped Caustics from Conical Prisms: a 13th Century Account of Rainbow Formation from Robert Grosseteste’s De iride.

X-ray Scattering from Spintronic Structures (2016)
Book Chapter
Tanner, B. (2016). X-ray Scattering from Spintronic Structures. In Y. Xu, D. D. Awschalom, & J. Nitta (Eds.), Handbook of Spintronics (919-945). Springer Netherlands. https://doi.org/10.1007/978-94-007-6892-5_33

The principles and underlying physics of grazing-incidence X-ray scattering are outlined in the context of application to the study of room temperature spintronic systems. Examples are presented showing the precision and reliability of analysis. The... Read More about X-ray Scattering from Spintronic Structures.

Twinning in vapour-grown, large volume Cd1-xZnxTe crystals (2016)
Journal Article
Tanner, B., Mullins, J., Pym, A., & Maneuski, D. (2016). Twinning in vapour-grown, large volume Cd1-xZnxTe crystals. Journal of Crystal Growth, 448, 44-50. https://doi.org/10.1016/j.jcrysgro.2016.05.011

The onset of twinning from View the MathML source to View the MathML source in large volume Cd1−xZnx Te crystals, grown by vapour transport on View the MathML source, often referred to as (211)B, oriented GaAs seeds, has been investigated using X-ray... Read More about Twinning in vapour-grown, large volume Cd1-xZnxTe crystals.

Nondestructive Monitoring of Die Warpage in Encapsulated Chip Packages (2016)
Journal Article
Bose, A., Vijayaraghavan, R., Cowley, A., Cherman, V., Tanner, B., Danilewsky, A., …McNally, P. (2016). Nondestructive Monitoring of Die Warpage in Encapsulated Chip Packages. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 6(4), 653-662. https://doi.org/10.1109/tcpmt.2016.2527060

We describe an X-ray diffraction imaging technique for nondestructive, in situ measurement of die warpage in encapsulated chip packages at acquisition speeds approaching real time. The results were validated on a series of samples with known inbuilt... Read More about Nondestructive Monitoring of Die Warpage in Encapsulated Chip Packages.

X-ray asterism and the structure of cracks from indentations in silicon (2016)
Journal Article
Tanner, B., Garagorri, J., Gorostegui-Colinas, E., Elizalde, M., Allen, D., McNally, P., …Danilewsky, A. (2016). X-ray asterism and the structure of cracks from indentations in silicon. Journal of Applied Crystallography, 49(1), 250-259. https://doi.org/10.1107/s1600576715024620

The asterism observed in white radiation X-ray diffraction images (topographs) of extended cracks in silicon is investigated and found to be associated with material that is close to breakout and surrounded by extensive cracking. It is a measure of t... Read More about X-ray asterism and the structure of cracks from indentations in silicon.

The Geometry of Catastrophic Fracture during High Temperature Processing of Silicon (2015)
Journal Article
Tanner, B., Garagorri, J., Gorostegui-Colinas, E., Elizalde, M., Bytheway, R., McNally, P., & Danilewsky, A. (2015). The Geometry of Catastrophic Fracture during High Temperature Processing of Silicon. International Journal of Fracture, 195(1-2), 79-85. https://doi.org/10.1007/s10704-015-0050-1

The geometry of fracture associated with the propagation of cracks originating at the edges of (001) oriented, 200 mm diameter silicon wafers has been investigated under two regimes of high temperature processing. Under spike annealing, fracture did... Read More about The Geometry of Catastrophic Fracture during High Temperature Processing of Silicon.

A medieval multiverse?: Mathematical modelling of the thirteenth century universe of Robert Grosseteste (2014)
Journal Article
Bower, R., McLeish, T., Tanner, B., Smithson, H., Panti, C., Lewis, N., & Gasper, G. (2014). A medieval multiverse?: Mathematical modelling of the thirteenth century universe of Robert Grosseteste. Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, 470(2167), Article 40025. https://doi.org/10.1098/rspa.2014.0025

In his treatise on light, written about 1225, Robert Grosseteste describes a cosmological model in which the universe is created in a big-bang-like explosion and subsequent condensation. He postulates that the fundamental coupling of light and matter... Read More about A medieval multiverse?: Mathematical modelling of the thirteenth century universe of Robert Grosseteste.

Color-coordinate system from a 13th-century account of rainbows (2014)
Journal Article
Smithson, H., Anderson, P., Dinkova-Bruun, G., Gasper, G., Laven, P., McLeish, T., …Tanner, B. (2014). Color-coordinate system from a 13th-century account of rainbows. Journal of the Optical Society of America A, 31(4), A341-A349. https://doi.org/10.1364/josaa.31.00a341

We present a new analysis of Robert Grosseteste’s account of color in his treatise De iride (On the Rainbow), dating from the early 13th century. The work explores color within the 3D framework set out in Grosseteste’s De colore [see J. Opt. Soc. Am.... Read More about Color-coordinate system from a 13th-century account of rainbows.

Crack propagation and fracture in silicon wafers under thermal stress (2013)
Journal Article
Danilewsky, A., Wittge, J., Kiefl, K., Allen, D., McNally, P., Garagorri, J., …Tanner, B. (2013). Crack propagation and fracture in silicon wafers under thermal stress. Journal of Applied Crystallography, 46(4), 849-855. https://doi.org/10.1107/s0021889813003695

The behaviour of microcracks in silicon during thermal annealing has been studied using in situ X-ray diffraction imaging. Initial cracks are produced with an indenter at the edge of a conventional Si wafer, which was heated under temperature gradien... Read More about Crack propagation and fracture in silicon wafers under thermal stress.