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X-ray diffraction imaging for predictive metrology of crack propagation in 450-mm diameter silicon wafers

Tanner, BK; Wittge, J; Vagovič, P; Baumbach, T; Allen, D; McNally, PJ; Bytheway, R; Jacques, D; Fossati, MC; Bowen, DK; Garagorri, J; Elizalde, MR; Danilewsky, AN

Authors

J Wittge

P Vagovič

T Baumbach

D Allen

PJ McNally

R Bytheway

D Jacques

MC Fossati

DK Bowen

J Garagorri

MR Elizalde

AN Danilewsky



Citation

Tanner, B., Wittge, J., Vagovič, P., Baumbach, T., Allen, D., McNally, P., …Danilewsky, A. (2013). X-ray diffraction imaging for predictive metrology of crack propagation in 450-mm diameter silicon wafers. Powder Diffraction, 28(02), 95-99. https://doi.org/10.1017/s0885715613000122

Journal Article Type Article
Acceptance Date Sep 25, 2013
Publication Date 2013
Deposit Date Sep 25, 2015
Journal Powder Diffraction
Print ISSN 0885-7156
Electronic ISSN 1945-7413
Publisher Cambridge University Press
Peer Reviewed Peer Reviewed
Volume 28
Issue 02
Pages 95-99
DOI https://doi.org/10.1017/s0885715613000122
Public URL https://durham-repository.worktribe.com/output/1399176



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