X-ray imaging of silicon die within fully packaged semiconductor devices
(2021)
Journal Article
Tanner, B. K., McNally, P. J., & Danilewsky, A. N. (2021). X-ray imaging of silicon die within fully packaged semiconductor devices. Powder Diffraction, 36(2), 78-84. https://doi.org/10.1017/s088571562100021x
X-ray diffraction imaging (XRDI) (topography) measurements of silicon die warpage within fully packaged commercial quad-flat no-lead devices are described. Using synchrotron radiation, it has been shown that the tilt of the lattice planes in the Anal... Read More about X-ray imaging of silicon die within fully packaged semiconductor devices.