X-ray diffraction imaging for predictive metrology of crack propagation in 450-mm diameter silicon wafers (2013)
Journal Article
Tanner, B., Wittge, J., Vagovič, P., Baumbach, T., Allen, D., McNally, P., …Danilewsky, A. (2013). X-ray diffraction imaging for predictive metrology of crack propagation in 450-mm diameter silicon wafers. Powder Diffraction, 28(02), 95-99. https://doi.org/10.1017/s0885715613000122

In-situ grazing incidence x-ray diffraction measurements of relaxation in Fe/MgO/Fe epitaxial magnetic tunnel junctions during annealing (2013)
Journal Article
Eastwood, D., Ali, M., Hickey, B., & Tanner, B. (2013). In-situ grazing incidence x-ray diffraction measurements of relaxation in Fe/MgO/Fe epitaxial magnetic tunnel junctions during annealing. Journal of Magnetism and Magnetic Materials, 348, 128-131. https://doi.org/10.1016/j.jmmm.2013.08.018

Crack propagation and fracture in silicon wafers under thermal stress (2013)
Journal Article
Danilewsky, A., Wittge, J., Kiefl, K., Allen, D., McNally, P., Garagorri, J., …Tanner, B. (2013). Crack propagation and fracture in silicon wafers under thermal stress. Journal of Applied Crystallography, 46(4), 849-855. https://doi.org/10.1107/s0021889813003695

The behaviour of microcracks in silicon during thermal annealing has been studied using in situ X-ray diffraction imaging. Initial cracks are produced with an indenter at the edge of a conventional Si wafer, which was heated under temperature gradien... Read More about Crack propagation and fracture in silicon wafers under thermal stress.