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Inertial two- and three-dimensional thin film flow over topography

Veremieiev, S.; Thompson, H.M.; Lee, Y.C.; Gaskell, P.H.

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Authors

H.M. Thompson

Y.C. Lee



Abstract

The effect of inertia on gravity-driven thin film free-surface flow over substrates containing topography is considered. Flow is modelled using a depth-averaged form of the governing Navier–Stokes equations and the discrete analogue of the coupled equation set solved accurately using an efficient full approximation storage (FAS) and full multigrid (FMG) technique. The free-surface disturbance induced by topographic features is illustrated by considering examples of gravity-driven flow over and around peak, trench and occlusion topography. Results are presented which demonstrate how increasing Reynolds number can significantly enhance the magnitude of free-surface disturbances, a feature which may have important consequences for the wide range of coating process that aim to maximise free-surface planarity.

Citation

Veremieiev, S., Thompson, H., Lee, Y., & Gaskell, P. (2011). Inertial two- and three-dimensional thin film flow over topography. Chemical Engineering and Processing: Process Intensification, 50(5-6), 537-542. https://doi.org/10.1016/j.cep.2010.08.008

Journal Article Type Article
Acceptance Date Aug 6, 2010
Online Publication Date Aug 13, 2010
Publication Date May 1, 2011
Deposit Date Jan 26, 2015
Publicly Available Date Aug 21, 2015
Journal Chemical Engineering and Processing: Process Intensification
Print ISSN 0255-2701
Electronic ISSN 1873-3204
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 50
Issue 5-6
Pages 537-542
DOI https://doi.org/10.1016/j.cep.2010.08.008
Keywords Coating, Thin film flows, Microfluidics, Topography.
Public URL https://durham-repository.worktribe.com/output/1437810

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Copyright Statement
NOTICE: this is the author’s version of a work that was accepted for publication in Chemical Engineering and Processing: Process Intensification. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Chemical Engineering and Processing: Process Intensification, 50, 5-6, May 2011, 10.1016/j.cep.2010.08.008.






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