Brian Tanner b.k.tanner@durham.ac.uk
Conducting Exam Musician
X-ray imaging of silicon die within fully packaged semiconductor devices
Tanner, Brian K.; McNally, Patrick J.; Danilewsky, Andreas N.
Authors
Patrick J. McNally
Andreas N. Danilewsky
Abstract
X-ray diffraction imaging (XRDI) (topography) measurements of silicon die warpage within fully packaged commercial quad-flat no-lead devices are described. Using synchrotron radiation, it has been shown that the tilt of the lattice planes in the Analog Devices AD9253 die initially falls, but after 100 °C, it rises again. The twist across the die wafer falls linearly with an increase in temperature. At 200 °C, the tilt varies approximately linearly with position, that is, displacement varies quadratically along the die. The warpage is approximately reversible on cooling, suggesting that it has a simple paraboloidal form prior to encapsulation; the complex tilt and twisting result from the polymer setting process. Feasibility studies are reported, which demonstrate that a divergent beam and quasi-monochromatic radiation from a sealed X-ray tube can be used to perform warpage measurements by XRDI in the laboratory. Existing tools have limitations because of the geometry of the X-ray optics, resulting in applicability only to simple warpage structures. The necessary modifications required for use in situations of complex warpage, for example, in multiple die interconnected packages are specified.
Citation
Tanner, B. K., McNally, P. J., & Danilewsky, A. N. (2021). X-ray imaging of silicon die within fully packaged semiconductor devices. Powder Diffraction, 36(2), 78-84. https://doi.org/10.1017/s088571562100021x
Journal Article Type | Article |
---|---|
Online Publication Date | Mar 30, 2021 |
Publication Date | 2021-06 |
Deposit Date | May 20, 2021 |
Publicly Available Date | May 20, 2021 |
Journal | Powder Diffraction |
Print ISSN | 0885-7156 |
Electronic ISSN | 1945-7413 |
Publisher | Cambridge University Press |
Peer Reviewed | Peer Reviewed |
Volume | 36 |
Issue | 2 |
Pages | 78-84 |
DOI | https://doi.org/10.1017/s088571562100021x |
Public URL | https://durham-repository.worktribe.com/output/1242365 |
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Publisher Licence URL
http://creativecommons.org/licenses/by/4.0/
Copyright Statement
© The Author(s), 2021. Published by Cambridge University Press on behalf of
International Centre for Diffraction Data. This is an Open Access article, distributed under the
terms of the Creative Commons Attribution licence (http://creativecommons.org/licenses/by/4.0/),
which permits unrestricted re-use, distribution, and reproduction in any medium, provided the
original work is properly cited. [doi:10.1017/S088571562100021X]
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