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Nondestructive, In Situ Mapping of Die Surface Displacements in Encapsulated IC Chip Packages Using X-Ray Diffraction Imaging Techniques

Gorji, N.E.; Tanner, B.K.; Vijayaraghavan, R.K.; Danilewsky, A.N.; McNally, P.J.

Authors

N.E. Gorji

R.K. Vijayaraghavan

A.N. Danilewsky

P.J. McNally



Citation

Gorji, N., Tanner, B., Vijayaraghavan, R., Danilewsky, A., & McNally, P. (2017, December). Nondestructive, In Situ Mapping of Die Surface Displacements in Encapsulated IC Chip Packages Using X-Ray Diffraction Imaging Techniques. Presented at 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

Presentation Conference Type Conference Paper (published)
Conference Name 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
Publication Date 2017
Deposit Date Oct 12, 2018
Publisher Institute of Electrical and Electronics Engineers
Pages 520-525
DOI https://doi.org/10.1109/ectc.2017.175
Public URL https://durham-repository.worktribe.com/output/1142988



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