Gorji, N., Tanner, B., Vijayaraghavan, R., Danilewsky, A., & McNally, P. (2017, December). Nondestructive, In Situ Mapping of Die Surface Displacements in Encapsulated IC Chip Packages Using X-Ray Diffraction Imaging Techniques. Presented at 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)