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X-ray Scattering from Spintronic Structures (2016)
Book Chapter
Tanner, B. (2016). X-ray Scattering from Spintronic Structures. In Y. Xu, D. D. Awschalom, & J. Nitta (Eds.), Handbook of Spintronics (919-945). Springer Netherlands. https://doi.org/10.1007/978-94-007-6892-5_33

The principles and underlying physics of grazing-incidence X-ray scattering are outlined in the context of application to the study of room temperature spintronic systems. Examples are presented showing the precision and reliability of analysis. The... Read More about X-ray Scattering from Spintronic Structures.

Twinning in vapour-grown, large volume Cd1-xZnxTe crystals (2016)
Journal Article
Tanner, B., Mullins, J., Pym, A., & Maneuski, D. (2016). Twinning in vapour-grown, large volume Cd1-xZnxTe crystals. Journal of Crystal Growth, 448, 44-50. https://doi.org/10.1016/j.jcrysgro.2016.05.011

The onset of twinning from View the MathML source to View the MathML source in large volume Cd1−xZnx Te crystals, grown by vapour transport on View the MathML source, often referred to as (211)B, oriented GaAs seeds, has been investigated using X-ray... Read More about Twinning in vapour-grown, large volume Cd1-xZnxTe crystals.

Nondestructive Monitoring of Die Warpage in Encapsulated Chip Packages (2016)
Journal Article
Bose, A., Vijayaraghavan, R., Cowley, A., Cherman, V., Tanner, B., Danilewsky, A., …McNally, P. (2016). Nondestructive Monitoring of Die Warpage in Encapsulated Chip Packages. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 6(4), 653-662. https://doi.org/10.1109/tcpmt.2016.2527060

We describe an X-ray diffraction imaging technique for nondestructive, in situ measurement of die warpage in encapsulated chip packages at acquisition speeds approaching real time. The results were validated on a series of samples with known inbuilt... Read More about Nondestructive Monitoring of Die Warpage in Encapsulated Chip Packages.

X-ray asterism and the structure of cracks from indentations in silicon (2016)
Journal Article
Tanner, B., Garagorri, J., Gorostegui-Colinas, E., Elizalde, M., Allen, D., McNally, P., …Danilewsky, A. (2016). X-ray asterism and the structure of cracks from indentations in silicon. Journal of Applied Crystallography, 49(1), 250-259. https://doi.org/10.1107/s1600576715024620

The asterism observed in white radiation X-ray diffraction images (topographs) of extended cracks in silicon is investigated and found to be associated with material that is close to breakout and surrounded by extensive cracking. It is a measure of t... Read More about X-ray asterism and the structure of cracks from indentations in silicon.