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The Geometry of Catastrophic Fracture during High Temperature Processing of Silicon (2015)
Journal Article
Tanner, B., Garagorri, J., Gorostegui-Colinas, E., Elizalde, M., Bytheway, R., McNally, P., & Danilewsky, A. (2015). The Geometry of Catastrophic Fracture during High Temperature Processing of Silicon. International Journal of Fracture, 195(1-2), 79-85. https://doi.org/10.1007/s10704-015-0050-1

The geometry of fracture associated with the propagation of cracks originating at the edges of (001) oriented, 200 mm diameter silicon wafers has been investigated under two regimes of high temperature processing. Under spike annealing, fracture did... Read More about The Geometry of Catastrophic Fracture during High Temperature Processing of Silicon.