Dr Michael Cooke michael.cooke@durham.ac.uk
Senior Experimental Officer
Fabrication of micron scale metallic structures on photo paper substrates by low temperature photolithography for device applications
Cooke, M.D.; Wood, D.
Authors
D. Wood
Abstract
Using commercial standard paper as a substrate has a significant cost reduction implication over other more expensive substrate materials by approximately a factor of 100 (Shenton et al 2015 EMRS Spring Meeting; Zheng et al 2013 Nat. Sci. Rep. 3 1786). Discussed here is a novel process which allows photolithography and etching of simple metal films deposited on paper substrates, but requires no additional facilities to achieve it. This allows a significant reduction in feature size down to the micron scale over devices made using more conventional printing solutions which are of the order of tens of microns. The technique has great potential for making cheap disposable devices with additional functionality, which could include flexibility and foldability, simple disposability, porosity and low weight requirements. The potential for commercial applications and scale up is also discussed.
Citation
Cooke, M., & Wood, D. (2015). Fabrication of micron scale metallic structures on photo paper substrates by low temperature photolithography for device applications. Journal of Micromechanics and Microengineering, 25(11), Article 115017. https://doi.org/10.1088/0960-1317/25/11/115017
Journal Article Type | Article |
---|---|
Acceptance Date | Aug 24, 2015 |
Online Publication Date | Oct 7, 2015 |
Publication Date | Nov 1, 2015 |
Deposit Date | Oct 7, 2015 |
Publicly Available Date | Oct 7, 2016 |
Journal | Journal of Micromechanics and Microengineering |
Print ISSN | 0960-1317 |
Electronic ISSN | 1361-6439 |
Publisher | IOP Publishing |
Peer Reviewed | Peer Reviewed |
Volume | 25 |
Issue | 11 |
Article Number | 115017 |
DOI | https://doi.org/10.1088/0960-1317/25/11/115017 |
Public URL | https://durham-repository.worktribe.com/output/1421354 |
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Copyright Statement
This is an author-created, un-copyedited version of an article published in Journal of Micromechanics and Microengineering. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at http://dx.doi.org/10.1088/0960-1317/25/11/115017
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