Ahmet T. Erdogan
A CMOS SPAD Line Sensor With Per-Pixel Histogramming TDC for Time-Resolved Multispectral Imaging
Erdogan, Ahmet T.; Walker, Richard; Finlayson, Neil; Krstajic, Nikola; Williams, Gareth; Girkin, John; Henderson, Robert
Authors
Richard Walker
Neil Finlayson
Nikola Krstajic
Gareth Williams
Professor John Girkin j.m.girkin@durham.ac.uk
Professor
Robert Henderson
Abstract
A 512 × 16 single photon avalanche diode (SPAD)-based line sensor is designed in a 0.13- μm CMOS image sensor technology for time-resolved multispectral beam scanned imaging. The sensor has 23.78- μm pixel pitch and incorporates one SPAD array with 49.31% fill factor optimized for detection in the blue–green spectral region, and a second array at 15.75% fill factor optimized for the red-near-infrared response spectral region. Each pixel contains a 32-bin histogramming time-to-digital converter (TDC) with a mean time resolution of 51.20 ps. Histogram bin resolutions are adjustable from 51.20 ps to 6.55 ns per bin. The line sensor can operate in single photon counting (SPC) mode (102.1 giga-events/s), time-correlated SPC (TCSPC) mode (192.4 million-events/s) or on-chip histogramming mode (16.5 giga-events/s), increasing the count rate up to 85 times compared to TCSPC mode. Sensor capability is demonstrated through spectral fluorescence lifetime imaging, resolving three fluorophore populations with distinct fluorophore lifetimes.
Citation
Erdogan, A. T., Walker, R., Finlayson, N., Krstajic, N., Williams, G., Girkin, J., & Henderson, R. (2019). A CMOS SPAD Line Sensor With Per-Pixel Histogramming TDC for Time-Resolved Multispectral Imaging. IEEE Journal of Solid-State Circuits, 54(6), 1705-1719. https://doi.org/10.1109/jssc.2019.2894355
Journal Article Type | Article |
---|---|
Acceptance Date | Jan 6, 2019 |
Online Publication Date | May 26, 2019 |
Publication Date | May 31, 2019 |
Deposit Date | May 28, 2019 |
Publicly Available Date | May 28, 2019 |
Journal | IEEE Journal of Solid-State Circuits |
Print ISSN | 0018-9200 |
Electronic ISSN | 1558-173X |
Publisher | Institute of Electrical and Electronics Engineers |
Peer Reviewed | Peer Reviewed |
Volume | 54 |
Issue | 6 |
Pages | 1705-1719 |
DOI | https://doi.org/10.1109/jssc.2019.2894355 |
Public URL | https://durham-repository.worktribe.com/output/1300674 |
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