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Simple de-embedding and simulation technique to find permittivity with a THz vector network analyser

Hammler, J.; Gallant, A.J.; Balocco, C.

Simple de-embedding and simulation technique to find permittivity with a THz vector network analyser Thumbnail


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Abstract

A simple and fast method for measuring the dielectric constant with a THz vector network analyser (VNA) has been developed. A numeric de-embedding technique removes free-space propagation effects, then simulation of Maxwell's equations simultaneously fits both permittivity and thickness to measured scattering parameters. Results are presented for semiconductor and dielectric samples within the frequency range 750 GHz to 1.1 THz, showing excellent agreement with prior work. A statistical analysis of uncertainty is performed, which demonstrates the robustness of our method.

Citation

Hammler, J., Gallant, A., & Balocco, C. (2015, August). Simple de-embedding and simulation technique to find permittivity with a THz vector network analyser. Presented at 2015 40th International Conference on Infrared, Millimeter, and Terahertz waves (IRMMW-THz), Hong Kong, China

Presentation Conference Type Conference Paper (published)
Conference Name 2015 40th International Conference on Infrared, Millimeter, and Terahertz waves (IRMMW-THz)
Start Date Aug 23, 2015
End Date Aug 28, 2015
Acceptance Date Aug 23, 2015
Publication Date Aug 23, 2015
Deposit Date Dec 7, 2015
Publicly Available Date Jan 26, 2016
Publisher Institute of Electrical and Electronics Engineers
Pages 1-2
Series Title IEEE Conference Proceedings
Book Title 40th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), 23-28 August 2015, Hong Kong.
DOI https://doi.org/10.1109/irmmw-thz.2015.7327822
Keywords Frequency measurement, Permittivity, Permittivity measurement, Scattering parameters, Semiconductor device measurement, Thickness measurement.
Public URL https://durham-repository.worktribe.com/output/1152088
Additional Information Date of Conference: 23-28 August 2015

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Accepted Conference Proceeding (377 Kb)
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© 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.






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