Temperature control to increase inter-layer bonding strength in fused deposition modelling

Kumrai-Woodruff, R.; Wang, Q.

Abstract

Fused Deposition Modelling (FDM) provides opportunities for new development in numerous areas. Z-directional anisotropic strength caused by weak inter-layer bonding has been recognized as the reason for limited industry adoption of FDM. This paper aims to investigate increasing the Z-directional strength of Acrylonitrile Butadiene Styrene (ABS) using a temperature controlled print environment. The ambient temperature during printing was increased to reduce heat transfer from the print, thereby encouraging more polymer chain inter-diffusion between layers. Dogbone specimens were printed at ambient print temperatures between 24.8°C and 71.2°C and tensile tests were performed. A thermal camera was used to identify heat loss in the FDM process. Ultimate tensile strength was found to increase by a maximum of 104% compared to open enclosure printing. A stylus profiler and scanning electron microscopy were used to compare the quality of the inter-layer bonds, suggesting that additional polymer inter-diffusion occurred at hotter ambient temperatures. A weak positive relationship was found between ambient air temperature and inter-layer part strength. Further experimentation could provide scope to determine an ideal ambient print temperature that is likely to be dependent on print settings and the printer used.

Citation

Kumrai-Woodruff, R., & Wang, Q. (2020, August). Temperature control to increase inter-layer bonding strength in fused deposition modelling. Presented at The ASME 2020 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference (IDETC/CIE2020), St. Louis, MO, USA

• Presentation Conference Type: Conference Paper (published)
• Conference Name: The ASME 2020 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference (IDETC/CIE2020)
• Start Date: Aug 17, 2020
• End Date: Aug 19, 2020
• Acceptance Date: Mar 31, 2020
• Online Publication Date: Nov 3, 2020
• Publication Date: Nov 3, 2020
• Deposit Date: Dec 18, 2020
• Publicly Available Date: Jan 4, 2021
• Publisher: American Society of Mechanical Engineers
• Volume: Volume 6: 25th Design for Manufacturing and the Life Cycle Conference (DFMLC)
• Pages: DETC2020-22342, V006T06A002; 11 pages
• Series Title: International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
• DOI: https://doi.org/10.1115/detc2020-22342
• Public URL: https://durham-repository.worktribe.com/output/1139941
• Publisher URL: https://asmedigitalcollection.asme.org/IDETC-CIE/proceedings-abstract/IDETC-CIE2020/83952/V006T06A002/1089908