PICA-PICA: Exploring a Customisable Smart STEAM Educational Approach via a Smooth Combination of Programming, Engineering and Art
(2023)
Presentation / Conference Contribution
Nagai, T., Klem, S., Kayama, M., Asuke, T., Meccawy, M., Wang, J., Cristea, A. I., Stewart, C. D., & Shi, L. (2023, May). PICA-PICA: Exploring a Customisable Smart STEAM Educational Approach via a Smooth Combination of Programming, Engineering and Art. Presented at 2023 IEEE Global Engineering Education Conference (EDUCON), Kuwait
The STEAM approach in education has been gaining increasing popularity over the last decade. This is due to its potential in enhancing students' learning, when teaching arts and scientific disciplines together. This paper introduces the PICA-PICA con... Read More about PICA-PICA: Exploring a Customisable Smart STEAM Educational Approach via a Smooth Combination of Programming, Engineering and Art.