In-Operando X-ray diffraction imaging of thermal strains in fully packaged silicon devices
(2019)
Journal Article
Tanner, B., Vijayaraghavan, R., Roarty, B., Danilewsky, A., & McNally, P. (2019). In-Operando X-ray diffraction imaging of thermal strains in fully packaged silicon devices. Microelectronics Reliability, 99, 232-238. https://doi.org/10.1016/j.microrel.2019.06.006
The application of X-ray Diffraction Imaging to measure in operando thermal strains at individually powered components within fully packaged LM3046 silicon devices is described. It is shown that as the local strains increase with power dissipated, ab... Read More about In-Operando X-ray diffraction imaging of thermal strains in fully packaged silicon devices.