2D MXene Ti3C2Tx Enhanced Plasmonic Absorption in Metasurface for Terahertz Shielding

Ullah, Zaka; Al Hasan, Muath; Ben Mabrouk, Ismail; Junaid, Muhammad; Sheikh, Fawad

Abstract

With the advancement of technology, shielding for terahertz (THz) electronic and communication equipment is increasingly important. The metamaterial absorption technique is mostly used to shield electromagnetic interference (EMI) in THz sensing technologies. The most widely used THz metamaterial absorbers suffer from their narrowband properties and the involvement of complex fabrication techniques. Materials with multifunctional properties, such as adjustable conductivity, broad bandwidth, high flexibility, and robustness, are driving future development to meet THz shielding applications. In this article, a theoretical simulation approach based on finite difference time domain (FDTD) is utilized to study the absorption and shielding characteristics of a two-dimensional (2D) MXene Ti3C2Tx metasurface absorber in the THz band. The proposed metamaterial structure is made up of a square-shaped array of MXene that is 50 nm thick and is placed on top of a silicon substrate. The bottom surface of the silicon is metalized with gold to reduce the transmission and ultimately enhance the absorption at 1–3 THz. The symmetric adjacent space between the MXene array results in a widening of bandwidth. The proposed metasurface achieves 96% absorption under normal illumination of the incident source and acquires an average of 25 dB shielding at 1 THz bandwidth, with the peak shielding reaching 65 dB. The results show that 2D MXene-based stacked metasurfaces can be proven in the realization of low-cost devices for THz shielding and sensing applications.

Citation

Ullah, Z., Al Hasan, M., Ben Mabrouk, I., Junaid, M., & Sheikh, F. (2023). 2D MXene Ti3C2Tx Enhanced Plasmonic Absorption in Metasurface for Terahertz Shielding. Computers, Materials & Continua, 75(2), 3453-3464. https://doi.org/10.32604/cmc.2023.034704

• Journal Article Type: Article
• Acceptance Date: Sep 23, 2022
• Online Publication Date: Mar 31, 2023
• Publication Date: 2023
• Deposit Date: Feb 20, 2024
• Publicly Available Date: Feb 20, 2024
• Journal: Computers, Materials & Continua
• Print ISSN: 1546-2218
• Electronic ISSN: 1546-2226
• Publisher: Tech Science Press
• Peer Reviewed: Peer Reviewed
• Volume: 75
• Issue: 2
• Pages: 3453-3464
• DOI: https://doi.org/10.32604/cmc.2023.034704
• Public URL: https://durham-repository.worktribe.com/output/2270985