D. Xiang
Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification
Xiang, D.; Ran, L.; Tavner, P.; Yang, S.; Bryant, A.; Mawby, P.
Authors
L. Ran
P. Tavner
S. Yang
A. Bryant
P. Mawby
Abstract
Condition monitoring power semiconductor devices can inform converter maintenance and reduce damage. This paper presents a method to monitor solder fatigue in a voltage source inverter insulated gate bipolar transistor power module by detecting the change of an inverter output harmonic. It is shown that low-order harmonics, caused by nonideal switching, are affected by the device junction temperature, which in turn depends upon module solder condition. To improve the detection accuracy of the phenomenon, the inverter controller is set to cause harmonic resonance at the target harmonic frequency. The would-be resonance is suppressed by an outer control loop where the control action can be used as the condition monitoring signal. Simulation and experiment are presented to validate the method and evaluate its performance in operation.
Citation
Xiang, D., Ran, L., Tavner, P., Yang, S., Bryant, A., & Mawby, P. (2012). Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification. IEEE Transactions on Power Electronics, 27(1), 235-247. https://doi.org/10.1109/tpel.2011.2160988
Journal Article Type | Article |
---|---|
Publication Date | Jan 1, 2012 |
Deposit Date | Jun 25, 2011 |
Journal | IEEE Transactions on Power Electronics |
Print ISSN | 0885-8993 |
Electronic ISSN | 1941-0107 |
Publisher | Institute of Electrical and Electronics Engineers |
Peer Reviewed | Peer Reviewed |
Volume | 27 |
Issue | 1 |
Pages | 235-247 |
DOI | https://doi.org/10.1109/tpel.2011.2160988 |
Keywords | Condition monitoring, Harmonic, Identification, Insulated gate bipolar transistor (IGBT), Power module, Reliability, Resonance, Solder fatigue. |
Public URL | https://durham-repository.worktribe.com/output/1507171 |
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