Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Yang, S; Xiang, D; Bryant, A; Mawby, P; Ran, L; Tavner, P

Abstract

Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.

Citation

Yang, S., Xiang, D., Bryant, A., Mawby, P., Ran, L., & Tavner, P. (2010). Condition Monitoring for Device Reliability in Power Electronic Converters: A Review. IEEE Transactions on Power Electronics, 25(11), 2734-2752. https://doi.org/10.1109/tpel.2010.2049377

• Journal Article Type: Article
• Publication Date: Nov 1, 2010
• Deposit Date: Nov 3, 2011
• Journal: IEEE Transactions on Power Electronics
• Print ISSN: 0885-8993
• Electronic ISSN: 1941-0107
• Publisher: Institute of Electrical and Electronics Engineers
• Peer Reviewed: Peer Reviewed
• Volume: 25
• Issue: 11
• Pages: 2734-2752
• DOI: https://doi.org/10.1109/tpel.2010.2049377
• Keywords: Condition monitoring (CM), Failure mechanism, Fault detection, Power electronics, Prognosis, Reliability.
• Public URL: https://durham-repository.worktribe.com/output/1503896