Modelling and Experimental Verification of Heat Dissipation Mechanisms in an SU-8 Electrothermal Microgripper

Solano, B.; Merrell, J.; Gallant, A.J.; Wood, D.

doi:10.1016/j.mee.2014.06.002

Modelling and Experimental Verification of Heat Dissipation Mechanisms in an SU-8 Electrothermal Microgripper

Solano, B.; Merrell, J.; Gallant, A.J.; Wood, D.

Authors

B. Solano

J. Merrell

Professor Andrew Gallant a.j.gallant@durham.ac.uk
Professor

D. Wood

Abstract

Within this work, a microgripper based on a hot–cold arm principle was tested to give a greater understanding of the associated heat dissipation methods. Experiments were conducted in air at atmospheric and sub-atmospheric pressure, and in helium, argon and helium at sub-atmospheric pressure. The change in deflection, when using gases with different thermal conductivities and at varying pressures showed the significance of conduction through the atmosphere. The experimental results were found to verify a theoretical model created previously by this group, and a further model developed independently; both predicted the deflection that a given current would cause.

Citation

Solano, B., Merrell, J., Gallant, A., & Wood, D. (2014). Modelling and Experimental Verification of Heat Dissipation Mechanisms in an SU-8 Electrothermal Microgripper. Microelectronic Engineering, 124, 90-93. https://doi.org/10.1016/j.mee.2014.06.002

Journal Article Type	Article
Acceptance Date	Jun 2, 2014
Publication Date	Jul 25, 2014
Deposit Date	Apr 10, 2015
Publicly Available Date	Jun 1, 2015
Journal	Microelectronic Engineering
Print ISSN	0167-9317
Electronic ISSN	1873-5568
Publisher	Elsevier
Peer Reviewed	Peer Reviewed
Volume	124
Pages	90-93
DOI	https://doi.org/10.1016/j.mee.2014.06.002
Keywords	Microgripper, Heat dissipation, Thermal imaging, Electrothermal, SU-8.
Public URL	https://durham-repository.worktribe.com/output/1410355

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Copyright Statement
NOTICE: this is the author’s version of a work that was accepted for publication in Microelectronic Engineering. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Microelectronic Engineering, 124, 25 July 2014, 10.1016/j.mee.2014.06.002.