M. Rees
Design and analysis of a sustainable multi-objective distribution network using simulation-based optimisation
Rees, M.; Wang, Q.
Abstract
This paper examines the distribution network for a manufacturing business looking at aspects of sustainability including economic, environmental and social considerations. The problem is initially approached mathematically, then applied experimentally using a specialist software, Orion-pi. A real life business, Rettig ICC, is used as a case study to show how the theory could be applied to a practical example and would provide financial savings, reduced carbon emissions and lay the groundwork for a more ethical business strategy. The results show it will be a financially and environmentally positive move to decrease the current activity at Birtley and operate an additional smaller distribution centre at Coventry.
Citation
Rees, M., & Wang, Q. (2014, December). Design and analysis of a sustainable multi-objective distribution network using simulation-based optimisation. Presented at ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference IDETC/CIE, Buffulo, New York, USA
Presentation Conference Type | Conference Paper (published) |
---|---|
Conference Name | ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference IDETC/CIE |
Acceptance Date | May 30, 2014 |
Publication Date | Jan 1, 2014 |
Deposit Date | May 3, 2013 |
Publisher | American Society of Mechanical Engineers |
Volume | 4 |
Pages | Paper No. DETC2014-34957, pp. V004T06A022; 10 pages |
Book Title | 19th Design for Manufacturing and the Life Cycle Conference; 8th International Conference on Micro- and Nanosystems, 17-20 August 2014, Buffalo, New York ; proceedings. |
DOI | https://doi.org/10.1115/detc2014-34957 |
Public URL | https://durham-repository.worktribe.com/output/1156559 |
Additional Information | Title of Proceedings Volume: 19th Design for Manufacturing and the Life Cycle Conference; 8th International Conference on Micro- and Nanosystems. |
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