STIFF: thermally safe temperature effect inversion aware FinFET based multi-core
(2022)
Presentation / Conference Contribution
Chakraborty, S., Soteriou, V., & Själander, M. (2022, May). STIFF: thermally safe temperature effect inversion aware FinFET based multi-core. Presented at CF '22: 19th ACM International Conference on Computing Frontiers, Turin Italy
FinFET, a non-planar device, has become the prevalent choice for chip-multiprocessor (CMP) designs due to its lower leakage and improved scalability as compared to planar CMOS devices. FinFETs are fundamentally different from conventional CMOS circui... Read More about STIFF: thermally safe temperature effect inversion aware FinFET based multi-core.