Danilewsky, A., Wittge, J., Kiefl, K., Allen, D., McNally, P., Garagorri, J., …Tanner, B. (2013). Crack propagation and fracture in silicon wafers under thermal stress. Journal of Applied Crystallography, 46(4), 849-855. https://doi.org/10.1107/s0021889813003695