Tanner, B., Vijayaraghavan, R., Roarty, B., Danilewsky, A., & McNally, P. (2019). In-Operando X-ray diffraction imaging of thermal strains in fully packaged silicon devices. Microelectronics Reliability, 99, 232-238. https://doi.org/10.1016/j.microrel.2019.06.006